Heavy Copper Pcb

Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication. The fiberglass substrate is a flame retardant (FR4) laminate,Website:http://www.xce-pcb.com, typically translucent in color and made of a continuous fine weave woven glass cloth. The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process. The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns. Heavy Copper PCB General Info Heavy Copper Board does not have a set of definition per IPC. According to PCB industry, however, peopel generally use this name to identify a printed circuit board with copper conductors 3 oz/ft2 - 10 oz/ft2 in inner and/or outer layers. And Extreme heavy copper PCB refers to 20 oz/ft2 to 200 oz/ft2 printed circuit board Heavy copper normally used for a various products but not limited to: high power distribution, heat dissipation, planar transformers, power convertors, and so on Design Guide for Heavy Copper PCB Typical conductor width/spacing/thickness tolerance is +/-20%, although tighter tolerance is achievable. The minimum width and thickness of a heavy copper PCB conductor is determined primarily on the basis of the current carrying capacity required and the maximum permissible conductor temperature rise. A circuit board trace, depending on its size and manufacturing process, may not be rectangular in shape. Heavy copper conductors can significantly add to the overall board thickness. Additive (plating) processed are preferred to subtractive (etching) processes but are more expensive).Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication. The fiberglass substrate is a flame retardant (FR4) laminate, typically translucent in color and made of a continuous fine weave woven glass cloth. The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process. The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns. Copper Clad PC Boardscan be clad double-sided or single-sided. The copper is commonly available in ½ oz, 1 oz, and 2 oz weights, although heavier weights are available. Copper can be clad up to 6 ounces while still maintaining a very strong dielectric strength. The G10 FR4 material substrate can be made in black, blue or red for high end optical applications or aesthetic applications.   In addition to some of the standard sizes like .062 thick PCB and .032 thick FR4 PCB, we offer thin film clad material. We can make the material as small as 4 mil and 5 mil (.004" - .005") as a core thickness for the G10 FR substrate. Another option for the copper clad laminate is our Ultraviolet (UV) Blocking chemical that we can add to the FR4 that blocks out the full spectrum of light up to 405 nm. We offer a High-temperature copper clad laminate in FR5 compliant to IPC 4101/23 for more sophisticated circuitry. The High Temp clad material has a higher thermal range for use in high frequency and burn-in boards.   There are many applications for the copper cladding on the G10 material such as : Antennas, RFI/EFI and Microwave products that need a low dissipation factor. Broadband, Telecom, Consumer Electronics ... just about everywhere electronic circuits are needed.MaterialCooper Clad LaminateBoard Thinckness1.2mmLayerDouble sidedSize15*20ColorGreenSurface FinishHaslSolder MaskerBlackCopper Thinckness1 Oz PCBCapability Layer1-30LMaterialCEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate.Board Thinckness0.2-6mmMax Finish Size800*508mmMin. Drill Hole Size0.25mmMin. Line Width0.075mm(3mil)Min. Line Spacing0.075mm(3mil)Surface finishHAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSPCopper thickness0.5-4.0 OzSolder mask colorgreen/black/white/red/blue/yellowInner packingVacuum packing, Plastic BagOuter packingstandard carton packingHole tolerancePTH:±0.076,NTPH:±0.05CertificateISO9001,SGSProfiling punchingRouting,V-CUT,Beveling